LAC200 is an economical 8"" wafer cleaning machine designed to clean wafers cut with a dicing saw. Leveraging the atomizing system, the cleaner can generate high-pressure mist droplets to hit and clean the workpiece surface and the dicing street.
Wafer size
6"", 8""
Compact and neat
Economical cleaner, small footprint, low energy consumption and outstanding cleaning effect/performance.
High efficiency
Small footprint, high efficiency, low noise
Highly applicability
Meet 3~8 inch wafers, maximum 250*250 square disks.
Easy operation
Provide several cleaning modes with quick switchover feature
+86-0510-81816658
sales@wxautowell.com
No.3 Xinhua Road,
